Gong Weibin: Problems and solutions for LED package lighting and backlight applications
On June 10, 2010, the “6th China LED Industry Theme Summit Forum†hosted by Gaogong LED was successfully held at the Guangzhou China Import and Export Fair. The conference was held concurrently with the 2010 Guangzhou International Lighting Exhibition. The topics covered include the talent, market, investment, technology, EMC model and other hot topics in the current LED industry.
General Manager of Ruifeng Optoelectronics Gong Weibin
Mr. Tang Guoqing, General Manager of CREE China Market, Zhang Jiliu, Chairman of Zhongwei Optoelectronics, Gong Weibin, General Manager of Ruifeng Optoelectronics, He Wenming, Chairman of Zhongke Wanbang, Xiong Kecang, Chairman of Lelei Optoelectronics, and Zhang Hui, Deputy General Manager of Guanyu Technology Co., Ltd. Li Yimin, vice president of TCL Lighting, Ye Rongnan, professor-level senior engineer of Fujian Optoelectronics Industry Association, Deng Hao, lawyer of Cubic Law Firm, Zhang Ziqi, general manager of Sunda Baili, Chen Bin, general manager of Zhonglong Transportation, and LED Industry Research Institute (GLII) Dr. Zhang Xiaofei and other experts made a wonderful theme report in the forum.
The conference attracted 600 spectators. They are senior managers, technical experts, and members of investment institutions and government agencies from foreign lighting companies.
In the LED package, there are some bottlenecks in the field of lighting and backlighting. Gong Weibin, general manager of Ruifeng Optoelectronics pointed out that LED lighting has higher power and higher requirements for heat dissipation and light decay; while backlighting is mainly for consistency requirements. However, LED TV color rendering and reliability are the key points. Consumers choose LED TV mainly to be optimistic about its color performance. At the same time, for LED TV, one LED is broken, and the whole TV is darkened. This is a difficult for many domestic companies. He believes that the solution is mainly the improvement of light efficiency, the solution of heat dissipation, the way of phosphor distribution and the development of high reliability materials.
Gong Weibin said that the thinner the phosphor coating, the higher the efficiency obtained. From the packaging materials, it can be seen that the thermal resistance of the chip substrate material and the solid crystal material becomes the bottleneck of the thermal resistance of the high-power LED assembly. He also cited the advantages of eutectic flip-chip technology. He believes that the eutectic process will greatly improve the reliability of the high-power LED components due to the reduction of the overall thermal resistance for high-power LEDs. For a 40 mil chip, the thermal resistance can be controlled at 1 W/mk. By using a eutectic process and other packages, the overall thermal resistance can be controlled within 6 W/mk.
He said that in the domestic unsatisfactory equipment, the use of solder paste can only be said to be a temporary measure, and the supporting substrate materials also need to be selected. The advantage of flip chip technology is that it can improve the light extraction efficiency of the wafer and improve the heat dissipation path.
However, Gong Weibin finally stressed that LED backlight has the advantages of low power consumption, thinness and high color saturation. At present, LEDs still need a lot of improvement in TV applications, such as heat dissipation, metamerism, improvement of light efficiency, and choice of optical design and light guiding materials. The field of lighting and backlighting is the twin spindle of LED growth, LED technology. The upgrade will make its application field wider.
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