COB light source use precautions
Unlike traditional SMD packages, COB (Chip-on-Board) LED technology integrates one or multiple chips directly onto an aluminum substrate, significantly improving heat dissipation and overall performance. With low thermal resistance, cost-effective assembly, and excellent light uniformity, COB LEDs have become a popular choice in the lighting industry, especially for high-power applications.
Important Precautions for Using COB Light Sources
Static Electricity Protection: COB LEDs are highly sensitive to static electricity. To prevent damage, ensure proper grounding with a resistance of less than 10 ohms. Always use anti-static wrist straps, mats, gloves, and workwear. Ground your soldering iron properly to avoid any electrostatic discharge that could harm the device.
Soldering Guidelines:
For manual soldering, use a soldering iron with power below 20W and keep the temperature under 300°C. Limit soldering time to no more than 3 seconds. For reflow soldering, follow the recommended temperature curve. After soldering, allow the product to cool down to room temperature before handling it carefully.
Cleaning Procedures:
After soldering, clean the component using isopropyl alcohol or denatured alcohol (with concentration above 95%). The cleaning process should be carried out at 50°C for up to 30 seconds or at 30°C for up to 3 minutes. Use ultrasonic cleaning with a maximum power of 300W to ensure thorough removal of residues.
Additional Tips:
Avoid touching the gel or lens parts of the COB LED at all times. Any contact may cause surface defects or even render the LED non-functional.
Cree introduced the XLamp® CXA2011 in 2011, followed by several new models such as CXA1304, CXA1310, CXA1507, CXA1512, CXA1816, CXA1820, CXA1830, CXA1850, CXA2520, CXA2530, CXA2540, CXA2590, CXA3050, CXA3070, and CXA3590, totaling 15 COB series products.
The XLamp® CXA Series COB light sources offer numerous benefits, including easy assembly, compact design, and compatibility with standard sizes like LES Zhaga. They are ideal for various applications such as lamps, track lights, downlights, spotlights, and outdoor lighting. This guide provides best practices for handling and manufacturing these high-power COB LEDs.
Key Handling Considerations for XLamp® CXA Series COB Light Sources
To ensure optimal performance and longevity, Cree recommends following these guidelines when working with XLamp® CXA series COB sources:
1. Avoid applying mechanical stress to the LED during handling or installation.
2. Never touch the optical surface with fingers or sharp objects. When using tweezers or handling the COB module, avoid pressing or contacting the lens to prevent damage or contamination.
3. Always use anti-static grounding measures, such as an electrostatic ring or grounded power supplies, to protect against ESD damage.
4. Wear powder-free latex gloves when handling the COB modules to prevent oils or dirt from affecting the surface quality.
Mounting the XLamp® CXA Series COB Light Source
Proper mounting is essential for effective thermal management. Cree recommends securing the COB module on a suitable heat sink, depending on the operating conditions. A thermally conductive material—such as thermal paste or a TIM pad—should be used between the COB and the heat sink to ensure efficient heat transfer. Keep the TIM layer thin and free of voids for optimal performance.
For certain models like CXA15xx, CXA25xx, and CXA3050, reflective TIM pads may be used. However, darker TIMs can slightly reduce light output and efficiency. Popular suppliers of thermal interface materials include 3M, GrafTech, Laird, and Lord.
Connectors are also available to simplify the mounting process. Companies like Molex, TE Connectivity, IDEAL, and United States Up to Optical have developed connectors specifically for the XLamp® CXA series. These connectors offer ease of assembly, good repeatability, and the ability to replace LEDs easily, though they may not always align perfectly with every design.
For the CXA2011 model, two diagonal screw holes are available for secure mounting. Cree recommends using #4 (40) or M2.5 screws, with a torque limit of approximately 45 N·cm to avoid damaging the LED array.
Soldering Instructions for XLamp® CXA Series COB Light Sources
Wire bonding is suitable for the XLamp® CXA Series COB. Cree suggests using a soldering iron with a tip size of 1.8 mm. Due to variations in heat sinks, LEDs, and soldering tools, specific recommendations may vary. After soldering, allow the COB to cool to room temperature before further processing.
Cree advises against exposing the COB to temperatures above 350°C. When soldering wire connectors directly to the COB, follow these steps:
1. Apply solder evenly to the contact pads of the COB module.
2. Solder the wires to the contact pads, ensuring even distribution of solder.
3. Provide sufficient strain relief for the wires to prevent pulling on the pads, which could damage the LED.
Cree recommends using “no-clean†solder paste, such as SnAgCu or SnAg, to minimize post-soldering cleaning efforts.
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