Intel recently announced the successful testing of a 17-qubit superconducting quantum computing chip in collaboration with QuTech, a leading Dutch research and development partner. This new chip, developed by Intel, is specifically designed to enhance throughput and performance, marking another milestone in the race for scalable quantum systems.
The achievement highlights the rapid progress made by Intel and QuTech in advancing quantum computing technology. It also underscores the critical role of materials science and semiconductor manufacturing in making quantum computing a reality. Quantum computing represents the next frontier in parallel processing, with the potential to solve complex problems that traditional computers struggle with.
For instance, quantum computers can simulate molecular structures, enabling breakthroughs in drug discovery, material science, and environmental solutions like carbon capture. However, building a large-scale, reliable quantum system remains a significant challenge. One of the key obstacles is ensuring qubits—quantum bits—are stable and consistent, as they are highly sensitive to external interference and require extremely cold operating conditions, often below 20 millikelvins.
To address these challenges, Intel’s Component Research Group (CR) in Oregon and the Assembly Test and Technology Development (ATTD) team in Arizona are pushing the boundaries of chip design and packaging. Their work is essential for creating practical quantum systems that can operate efficiently in real-world environments.
The 17-qubit test chip is compact, roughly the size of a 25-cent coin, and packaged in a small form factor of about 30mm × 2mm. Its improved features include:
- **New architecture**: Enhances reliability, thermal performance, and reduces RF interference between qubits.
- **Scalable interconnection solution**: Increases signal input/output capability by 10–100 times compared to traditional wire bonding methods.
- **Advanced processes, materials, and design**: Enables scaling for larger quantum integrated circuits.
Michael Mayberry, VP and President of Intel Research, emphasized that Intel’s expertise in manufacturing, electronics, and architecture gives it a unique advantage in the quantum space. “From neuromorphic computing to quantum computing, we’re pioneering new computing models,†he said.
Since 2015, Intel and QuTech have worked closely, achieving milestones such as integrating low-temperature CMOS control systems, developing spin-qubit manufacturing on Intel’s 300mm process, and creating novel packaging solutions for superconducting qubits.
Professor Leo DiCarlo from QuTech added that this test chip will help focus on connecting, controlling, and measuring multiple entangled qubits, which is crucial for error correction and building logic qubits. “This work will give us deeper insights into quantum computing and shape its future,†he said.
Beyond hardware, Intel’s collaboration with QuTech spans the entire quantum stack—from qubit devices to control systems and software. This holistic approach is vital for turning quantum research into practical applications.
Intel is also exploring different types of qubits, including superconducting and spin qubits in silicon. Spin qubits, similar to transistors, could be manufactured using existing semiconductor processes, offering a promising path toward scalability.
While quantum computers may outperform classical systems in certain areas, they won’t replace other emerging technologies like neuromorphic computing. Instead, they will complement them, all driven by the continued advancement of Moore’s Law.
Intel’s investment in quantum computing isn’t just about creating new computing paradigms—it’s about driving innovation and making the future of technology possible.
3.6V Cylindrical Battery
|
Model
|
Nominal Voltage
|
Nominal Capacity
|
Nominal impedance
|
Dimension
|
Charge-discharge standard
|
Approx Weight
|
|
|
(V)
|
(mAh)
|
(mQ)
|
Diameter
|
Height
|
Charge
|
Discharge
|
≈g
|
|
ICR10220
|
3.7
|
130
|
<150
|
10
|
22
|
0.5C-1C
|
0.5C-1C
|
4.1
|
|
ICR10440
|
3.7
|
350
|
<120
|
10
|
44
|
0.5C-1C
|
0.5C-1C
|
9
|
|
ICR14430
|
3.7
|
650
|
<100
|
13.8
|
42.8
|
0.5C-1C
|
0.5C-1C
|
17
|
|
ICR14500
|
3.7
|
900
|
<80
|
14
|
50
|
0.5C-1C
|
0.5C-1C
|
19.5
|
|
ICR17280
|
3.7
|
600
|
<100
|
16.3
|
28
|
0.5C-1C
|
0.5C-1C
|
15
|
|
ICR17335
|
3.7
|
700
|
<100
|
16.3
|
33.5
|
0.5C-1C
|
0.5C-1C
|
18
|
|
ICR18500
|
3.7
|
1400
|
<70
|
18.1
|
50
|
0.5C-1C
|
0.5C-1C
|
33
|
|
ICR18650
|
3.7
|
2000
|
<50
|
18.1
|
64.8
|
0.5C-1C
|
0.5C-1C
|
45
|
|
ICR18650P
|
3.7
|
2000
|
<40
|
18.1
|
65
|
0.5C-1C
|
3C-5C
|
45
|
|
ICR18650P
|
3.7
|
2200
|
<40
|
18.1
|
65
|
0.5C-1C
|
3C-5C
|
45
|
|
ICR18650
|
3.7
|
2600
|
<70
|
18.1
|
64.8
|
0.5C-1C
|
0.5C-1C
|
45
|
|
ICR26650
|
3.7
|
3500
|
<30
|
26
|
65.5
|
0.5C-1C
|
0.5C-1C
|
85
|
|
ICR26650P
|
3.7
|
5000
|
<30
|
26
|
65.5
|
0.5C-1C
|
0.5C-1C
|
85
|
|
ICR18650P
|
3.7
|
1500
|
<15
|
18.1
|
64.8
|
1C
|
10C-15C
|
47
|
|
ICR26650P
|
3.7
|
2200
|
<15
|
26
|
64.8
|
1C
|
10C-15C
|
64
|
|
IFR14430E
|
3.2
|
400
|
<115
|
13.8
|
43
|
0.5C-1C
|
0.5C-1C
|
15
|
|
IFR14500E
|
3.2
|
400
|
<95
|
13.8
|
50.2
|
0.5C-1C
|
0.5C-1C
|
15.5
|
|
IFR14500E
|
3.2
|
650
|
<80
|
13.8
|
50.2
|
0.5C-1C
|
0.5C-1C
|
17.8
|
|
IFR18500E
|
3.2
|
600
|
<80
|
18
|
50
|
0.5C-1C
|
0.5C-1C
|
19.5
|
|
IFR18500E
|
3.2
|
1200
|
<80
|
18
|
64.8
|
0.5C-1C
|
0.5C-1C
|
30.4
|
|
IFR18650E
|
3.2
|
1500
|
<65
|
18
|
64.8
|
0.5C-1C
|
0.5C-1C
|
40.5
|
|
IFR18650E
|
3.2
|
1700
|
<80
|
18
|
65.3
|
0.5C-1C
|
0.5C-1C
|
41.2
|
|
IFR26650E
|
3.2
|
3400
|
<20
|
26
|
65.3
|
0.5C-1C
|
0.5C-1C
|
87
|
|
IFR18650P
|
3.2
|
1100
|
<20
|
18
|
65.3
|
1-3C
|
10-25C
|
40
|
|
IFR26650P
|
3.2
|
2400
|
<20
|
26
|
65.3
|
1-3C
|
10-25C
|
82
|
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