In recent years, with the high density and high integration of electronic products, the importance of thermal solutions is increasing, and LED lighting is no exception, and thermal solutions are also needed. Although the energy loss of incandescent lamps and fluorescent lamps is large, most of the energy is directly radiated through infrared rays, and the light source generates less heat. In addition to the energy consumed by the visible light, the LEDs are converted into heat. In addition, since the LED package area is small, heat dissipation by convection and radiation is small, thereby accumulating a large amount of heat.
Thermal solution:
Next, consider how to develop a thermal solution. The thermal solution is simply to solve the various problems caused by heat.
1. Bending and cracking due to thermal expansion
2. Operational barriers to electronic circuits
3. Material quality deteriorates
In addition, it is also worried that if the heat will damage the equipment, in order to avoid these problems, it is necessary to control the temperature of the electronic equipment as much as possible, that is, effective heat dissipation is very important, and the focus is on considering the environment and installation method of the machine. Thermal solution. The problems caused by heat are listed below. The latter part uses LED lights as an example to explain LED-related solutions.
Heat caused problems
1. Bending and cracking due to thermal expansion
Electronic equipment consists of multiple parts, each of which has a different material, and the scale of thermal expansion and contraction is also different. Therefore, when various materials are combined, it is possible to bend the material. When expanding, the product will crack at the joint due to excessive stress.
2. Operational obstacles in electronic circuits
In general, a semiconductor element as a heat source has such a characteristic that when the temperature of a semiconductor element in an electronic device rises, the electrical impedance becomes small. In this way, it is easy to fall into a vicious cycle of "temperature rise - impedance drop - current increase - heat increase - temperature rise", and the blown phenomenon is likely to occur.
3. Deterioration of material quality
In general, materials used in electronic devices are easily oxidized, and the higher the temperature, the faster the oxidation. If these materials are repeatedly subjected to high temperature oxidation, their life will be shortened. At the same time, repeated heating, multiple expansion of the material, multiple shrinkage, will reduce the strength of the material, thereby destroying the material.
LED thermal solution:
Let's take the LED light as an example to discuss the thermal solution of LED.
There are many ways to avoid the heat of electronic devices. For example, add a radiator and place a fan that can provide cold air around the heat source. The former is to increase the heat dissipation area to increase the heat dissipation channel, and the latter is to make the heat not around the heat source. Moreover, the internal power supply board also generates heat, so the heat dissipation problem of the LED light can be said to be a very difficult problem. In this way, how to effectively use LED mounting materials and heat sinks becomes very important.
So how to effectively use LED mounting materials and heat sinks? First, we must grasp the heat transfer path that generates heat.
The heat generated by the LED elements moves through the packaged wires to the board and then dissipates heat through the heat sink. The same is true of the heat generated by the power board, which is radiated to the outside through the heat sink through the air and the filling material around the board.
It is important in the thermal solution to eliminate the factors that hinder heat transfer in the heat transfer path. For example, it is conceivable to use a material with good thermal conductivity in the heat transfer path and to enlarge the cross-sectional area of ​​the path.
In addition, even if the heat conduction characteristics are improved by these, if the heat sink does not dissipate heat to the outside, there is still a lot of heat inside. Therefore, it is also necessary to increase the heat release characteristics of the surface of the heat sink. The typical method is to install several heat sinks on the surface to enlarge the heat release area of ​​the heat sink.
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