The degree of automation of electronic equipment is a sign of whether a country is a powerful electronic manufacturing country. Domestic electronic machine SMT (surface mount technology) manufacturing equipment has made great progress in printing machines, reflow soldering, AOI (automatic optical inspection) equipment, etc., and the most critical placement machine in SMT production lines (except small placement machines) In terms of equipment, there is still no enterprise that can produce it, and it faces many problems such as severe capital, technology and standards. To realize the dream of becoming a powerful country in electronics manufacturing, we must take the road of independent research and development of SMT equipment and concentrate our strengths to break through the dilemma of industrialization of placement machines.
SMT (SurfaceMountTechnology) refers to a technology in which chip components are mounted and soldered on the surface of a printed circuit board. Compared with the traditional through-hole assembly technology, this technology has high assembly density, small product size (volume reduction of 40% to 60%), light weight (weight reduction of 60% to 80%), high reliability, strong vibration resistance, Easy to realize advantages such as automation.
At present, more than 80% of electronic products in developed countries such as Japan and the United States use SMT. Among them, network communication, computers and consumer electronics are the main application areas, with market shares of about 35%, 28% and 28%, respectively. Application areas also include automotive electronics, medical electronics, etc.
The SMT production line mainly includes the following types of equipment: placement machines, printing machines, SPI (solder paste inspection equipment), wave soldering equipment, reflow soldering equipment, AOI inspection equipment, X-Ray inspection equipment, rework stations, etc. The technologies involved include: placement technology, soldering technology, semiconductor packaging technology, assembly equipment design technology, circuit forming process technology, functional design simulation technology, etc.
Among them, the placement machine is used to achieve high-speed, high-precision, fully automatic placement equipment, related to the efficiency and accuracy of the SMT production line, is the most critical and most complex equipment, usually accounts for the entire SMT production line investment More than 60%. At present, the placement machine has developed from an early low-speed mechanical placement machine to a high-speed optical centering placement machine, and has developed into a multi-function, flexible and modular.
Domestic companies have emerged in the printing, welding, inspection and other links with more powerful companies, such as Nitto, Jintuo welding equipment, Keg's printing press, AOI inspection equipment of China Vision, X-Ray inspection equipment of UFJ Wait. However, the core link placement machine is still controlled by Japan, Germany, South Korea, and the United States. The main manufacturers include: ASMPT (ASMPT acquired the SIPLACE placement equipment division of Siemens in 2011), Panasonic, Global, Fuji, Yamaha, JUKI , Samsung, etc.
Driven by the new technology revolution and the new demands of economic and social development, major changes have taken place in both depth and breadth. At present, "transformation and upgrading" and "integration of two technologies" are the symbolic concepts that reflect changes in demand under the driving factors of these two aspects. Reducing labor costs and enhancing the level of automation are the fundamental requirements for technological transformation and upgrading of the manufacturing side, and also bring strong demand momentum for SMT equipment.
On the one hand, higher requirements are placed on the complexity and accuracy of production and manufacturing, processes, and specifications; on the other hand, the cost of labor and other factors is rising, facing dual demands for cost and efficiency. The above two reasons have led to automated, intelligent and flexible manufacturing, processing and assembly, system assembly and connection, packaging and testing. At present, Sichuan Changhong has planned to improve the level of automation through technological progress, thereby reducing costs and maintaining competitiveness, striving to reduce labor costs by 20% in the past 2 years and 50% in 4 years.
High performance, ease of use, flexibility and environmental protection are one of the main development trends of SMT equipment.
With the intensified competition in the electronics industry, companies need to continue to meet the ever-shortening time-to-market of new products, more stringent environmental requirements for cleaning and lead-free solder applications, and to comply with the trend of lower costs and more miniaturization, which is proposed for electronic manufacturing equipment. Higher requirements. Electronic equipment is developing in the direction of high precision, high speed, easier to use, more environmentally friendly and more flexible production lines. The high-speed head and the multi-function head of the placement machine can be switched arbitrarily; when the placement head is replaced with a dispensing head, it becomes a dispensing machine. The stability of printing and placement accuracy will be higher, and the flexibility that the parts and substrates change will be stronger.
At the same time, high-speed production lines and miniaturized equipment have brought high efficiency, low power, and low cost. For the placement machine, the demand for high-speed multi-function placement machines that can meet the production efficiency and multi-function dual-increasing is gradually increasing, and the production rate of the dual-channel placement production mode can reach about 100,000 CPH.
The convergence trend of semiconductor packaging and surface mount technology is obvious.
With the increasing miniaturization of electronic products, increasingly diversified functions, and increasingly sophisticated components, the integration of semiconductor packaging and surface mount technology has become a general trend. At present, semiconductor manufacturers have begun to apply high-speed surface mount technology, and the surface mount production line also integrates some applications of semiconductors. The traditional assembly level boundaries are increasingly blurred. The integrated development of technology has also brought many products that have been recognized by the market. For example, the direct wafer feeder of Universal Instruments subsidiary Unovis Solutions, provides a good solution for the fusion of surface mount and semiconductor assembly.
In terms of the placement speed of the placement machine, the SIPLACEX4iS exhibited by ASMPT, which represents the advanced level of the global placement machine, has a placement speed of 150,000 CPH, and the actual placement cycle is 0.024 seconds / point.
The JEITA Electronic Assembly Technical Committee predicted in the "Assembly Technology Roadmap 2013" that with the explosive growth of consumer demand for low-end and low-end electronic products, the demand for ultra-large-scale production is expected to make the placement speed of the placement machine in 2016. Reached 160,000 CPH (0.0225 seconds / point) and reached 240000 CPH (0.015 seconds / point) in 2022. The mounting speed of chip-scale packaged devices will increase from 3600CPH in 2012 to 3800CPH in 2016 and 4000CPH in 2022.
At that time, the pick and place of the placement head of the placement machine will undergo a fundamental change. At the same time, the parts feeding department will also form a "feeding department system without parts supply and exchange". Enter people's vision.
At present, the chip parts used in electronic products tend to be smaller and thinner. The chip wiring pitch and the diameter of solder balls have been reduced, which places higher requirements on the alignment and positioning accuracy of the mounting equipment.
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