Analyze LED Display Packaging

Release date: 2017-11-27 Source: LED Network Share:

In today’s world, LED displays have become a common sight. While most people are familiar with the final product, the packaging process of LED lamp beads is often less understood. Today, Mingxinyuan Technology, an LED display manufacturer, takes a closer look at the different types of LED display packaging and how they impact performance and cost.

LED display packaging can be broadly categorized into three main types based on the technology used:

1. Dot Matrix Packaging: In this method, LED chips are arranged in a matrix and soldered onto a PCB board to form a module, which is then connected to external devices. This type offers excellent flatness, high reliability, and good protection levels. However, the production process is more complex, and the material quality must be high. It is commonly used for both indoor and outdoor displays, especially for screens with a pixel pitch larger than P3.

2. In-Line Packaging: This approach uses a bracket as the main package structure, with one end designed to hold the LED chip and the other end featuring pins for insertion into the mold. In-line packaged LEDs are typically used in outdoor displays with a pitch greater than 8mm. They offer high brightness and are easy to make waterproof and dustproof. However, they are not ideal for high-density displays due to their limitations in density and flexibility.

3. Surface-Mount Packaging: The key advantage of this method is its high level of automation, allowing it to be directly used in SMT (Surface Mount Technology) high-speed placement machines. This makes it particularly suitable for high-density indoor displays. Surface-mount packaging also offers better color consistency, but it requires additional protection measures to ensure durability.

Small-pitch LED displays, primarily used indoors, usually rely on surface-mount packaging. As the pixel pitch decreases, the number of LED beads per unit area increases exponentially, making automation essential for efficient production. Surface-mount packaging allows manufacturers to use high-speed placement machines to handle the growing number of components efficiently.

As the pixel pitch of LED displays continues to shrink, the proportion of LED beads in the overall screen becomes increasingly significant. According to our analysis, in small-pitch models like P1.9 or smaller, the cost of LED beads can exceed 70% of the total cost of the display.

It's important to note that there is a significant price difference between components of different quality levels—sometimes even doubling or tripling. As a result, displays with the same specifications from different manufacturers can vary greatly in cost and price. For example, Mingxinyuan’s P2.5 LED display uses premium imported LED beads and driver ICs, which can make its price twice as high as similar models using lower-quality components.

Currently, the high-end segment of LED display components—such as high-tech chips and packaged devices—is still dominated by foreign manufacturers, while Chinese companies mainly focus on the low-end market. Components like driver ICs and PCB boards, which have slightly lower technical barriers, are more localized. However, we believe that mainland LED display companies are rapidly catching up in both production capacity and technological innovation.

With the continuous improvement of domestic packaging technologies, we expect a significant increase in the localization of LED display packaging in the coming years. This will help reduce costs for smaller-pitch products, enabling them to enter the market and potentially replace traditional indoor display technologies. As the market grows, overseas packaging suppliers may also enter the scene, creating healthy competition that drives technological progress and further cost reductions.

Tag: Analyze LED Display Packaging

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