SMSC Introduces Industry's First High-Speed ​​Inter-Chip USB 2.0 Hub

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SMSC, a leading semiconductor manufacturer focused on diverse system connectivity solutions, has recently introduced its latest innovation in the High Speed Inter-Chip (HSIC) USB 2.0 technology: the USB3503. This groundbreaking product is the first high-speed USB portable hub controller to leverage SMSC's patented Inter-Chip Connection (ICC) technology, offering a low-power and cost-effective HSIC interface tailored for battery-powered portable applications.

With USB 2.0 now a standard in billions of devices, ICC technology provides a more efficient alternative to traditional analog interfaces by enabling short-distance communication with significantly reduced power consumption. Despite this efficiency, it remains fully compatible with existing USB 2.0 software stacks. The HSIC specification, as an enhancement to USB 2.0, is integrated into ICC, allowing for even greater power savings and smaller chip area—key advantages for portable designs.

Jesse Lyles, Director of USB and Network Solutions Marketing at SMSC, stated, "The growth of HSIC in the industry continues to expand. Its value proposition is straightforward: using HSIC as an interface between components allows designers to utilize the existing USB software stack for inter-chip communication." This approach simplifies design complexity while maintaining full compatibility with standard USB protocols.

As portable devices become more complex and feature-rich, the need for multiple USB ports increases. The USB3503 addresses this by providing three downstream ports, ideal for embedded systems requiring enhanced connectivity. It connects via HSIC to an upstream port and supports low-speed, full-speed, and high-speed devices across all downstream ports. Its compact 25-ball WLCSP package saves valuable PCB space, making it an excellent choice for applications where power efficiency, cost reduction, and battery charger detection are critical—such as smartphones, tablets, and e-readers.

Notably, companies like NVIDIA, Qualcomm, AMD, and Samsung have also adopted SMSC’s ICC technology to enable HSIC communication between SoCs and peripheral USB 2.0 devices. The USB3503 stands out as the first HSIC-based USB 2.0 hub controller designed specifically for portable consumer electronics. It delivers low power consumption and ultra-small pin count, along with proven performance from SMSC’s long history of USB 2.0 hub controllers.

The USB3503 also supports the latest USB-IF Battery Charging 1.1 specification and SMSC’s RapidCharge Anywhere™ feature, significantly reducing charging times. Additionally, its flexible power conditioning simplifies integration into battery-powered devices, further enhancing its appeal for portable applications.

Samples of the USB3503 are now available for evaluation. Below are the main specifications:

• Integrated USB 2.0 compatible three-port hub
• Advanced power-saving features including 1μA standby current
• USB-IF BC 1.1 detection function
• Supports single TT or multi-TT configuration for full speed and low speed connections
• Enhanced configuration options via serial I2C slave port
• Internal default configuration when no serial I2C host is present
• Includes proprietary technologies such as MultiTRAKâ„¢, PortMap, PortSwap, PHYBoost, VariSenseâ„¢, and flexPWR®
• External clock input options: 12, 19.2, 24, 25, 26, 27, 38.4, or 52MHz
• Internal 3.3V and 1.2V regulators for single supply operation
• Commercial (0°C ~ 70°C) and industrial (-40°C ~ 85°C) temperature range options
• USB port ESD protection (DP/DM) up to ±15kV (IEC 61000-4-2)
• 25-ball WLCSP package (1.95mm x 1.95mm), RoHS compliant