From the perspective of the development level of devices, the future development trend of packaging technology is: single chip to multi-chip development; planar packaging to three-dimensional packaging; independent chip packaging to system integrated packaging.
In recent years, various electronic products have been widely used in industry, agriculture, national defense, and daily life. With the vigorous development of electronic science and technology, the microelectronics industry has developed rapidly, which is largely due to the rapid development of microelectronics packaging technology. Today, the world is ushering in the era of electronic information technology with electronic computers as the core. With its development, electronic products are increasingly required to have high performance, multifunction, high reliability, miniaturization, thinness, convenience, and popularization. Features such as low cost required for popularization. This inevitably requires microelectronic packaging to be better, lighter, thinner, with higher packaging density, better electrical and thermal performance, higher reliability, and higher cost performance.
Microelectronic packaging refers to the process of arranging, pasting, fixing and connecting chips and other elements on a frame or substrate using film technology and microfabrication technology, leading out connection terminals and potting and fixing through a plastic insulating medium to form an overall three-dimensional structure. In a broader sense, it refers to the project of connecting and fixing the package body to the substrate, assembling into a complete system or electronic equipment, and determining the overall performance of the entire system.
The purpose of microelectronic packaging
The purpose of microelectronic packaging is to protect the chip from being affected by the external environment, or provide a good working condition, so that the circuit has a stable and normal function.
Technical field of microelectronic packaging
Microelectronic packaging technology covers a wide technical area and belongs to complex system engineering. It involves various disciplines such as physics, chemistry, chemical engineering, materials, machinery, electrical and automation, and also uses a variety of materials such as metals, ceramics, glass, polymers, etc. Therefore, microelectronic packaging is an interdisciplinary knowledge integration Science, which integrates the electrical characteristics, thermal conductivity characteristics, reliability, application of materials and process technology, and cost and price of products to achieve the optimization of engineering technology.
In the pursuit of improving the functions and levels of microelectronic products, the development of new packaging technologies is no less important than circuit design and process technology. The electronics industries of countries around the world are fully researching and developing with a view to gaining a leading position in this field.
Features of microelectronic packaging
There are four main functions of microelectronic packaging:
Transferring electrical energy mainly refers to the distribution and conduction of the power supply voltage.
The transmitted circuit signal is mainly to reduce the delay of the electrical signal as much as possible. When wiring, the interconnection path between the signal and the chip and the path drawn through the packaged I / O interface should be as short as possible.
The provision of heat dissipation means that all kinds of packaging must consider how the components and components dissipate the accumulated heat during long-term operation.
Structural protection and support mainly means that the encapsulation can provide solid and reliable mechanical support for the connected parts, and can adapt to changes in various working environments and conditions.
Technical level of microelectronic packaging
There are usually four levels of microelectronic packaging:
The first level: refers to the process of pasting and fixing the circuit chip and the packaging substrate or lead frame, circuit connection and packaging protection, making it a module that is easy to pick and place and transport, and can be connected to the next level of assembly and connection element.
The second level: the process of combining several packages and other electronic components completed in the first level to form a circuit card.
Third level: The process of combining several circuit cards assembled and packaged in the second level on a main circuit board to make it a component or subsystem.
Fourth level: Assemble several subsystems into a process to complete electronic products.
The wiring process between the circuit components on the chip is also called zero-level packaging, so packaging engineering can also be distinguished by five levels.
Classification of microelectronic packaging
According to the number of combined circuit chips in the package, microelectronic packages can be divided into two categories: single-chip package (SCP) and multi-chip package (MCP). MCP refers to the multi-chip package with a lower level, and MCM refers to the higher level. Chip packaging.
According to the sealing material, it can be divided into polymer-based materials (ie plastics) and ceramics. The ceramic package has stable thermal properties, excellent thermal conductivity, and good barrier to penetration of water molecules, so it is the main high-reliability packaging method; plastic packaging has the advantages of process automation, low cost, and thin packaging. Therefore, plastic packaging is The technology most commonly used in the market today.
According to the interconnection method of the device and the circuit board, the package can be divided into two types: pin insertion type (PTH) and surface mount type (SMT). The pins of the PTH device are thin needle-shaped or thin plate-shaped metal, which is inserted into the base or the guide hole of the circuit board for welding and fixing; the SMT device is first pasted on the circuit board and then fixed by welding. It has a seagull wing type and hook Type, straight shank type metal pins, or electrode bump pins (also called leadless devices).
According to the pin distribution, there are four types of packaged components: single-sided pins, double-sided pins, four-sided pins and bottom pins. Common single-sided pins include single-in-line package (SIP) and cross-pin package (ZIP); double-sided pin components include double-in-line package (DIP) and miniaturized package (SOP), etc .; four-side pins have four sides Flat package (QFP), metal cans (MCP) and dot array package (PGA) on the bottom pins.
Due to the demand for miniaturization of products and the improvement of functions and the advancement of process technology, there are many different changes in the form and internal structure of the package.
Materials for microelectronic packaging
Materials used in microelectronic packaging include metals, ceramics, glass, polymers, etc. Metals are mainly electrically conductive materials, ceramics and glass are the main components of ceramic packaging substrates, glass is also an important sealing material, and plastic packaging uses polymer resins For the sealing of components and shells, polymer materials are also important additives in many packaging processes. The use and selection of materials are related to the needs of the package's electrothermal properties, reliability, technology and process, cost and price.
Technical requirements for microelectronic packaging
With the rapid development of the microelectronics industry, microelectronics packaging technology has also continued to develop and progress.
1. Miniaturization
Microelectronics packaging technology is developing in the direction of ultra-miniaturization, and an ultra-miniature packaging form with the same size as the chip appears, namely wafer-level packaging technology (WLP). Low cost, high quality, short delivery time, and external dimensions comply with international standards are all necessary conditions for miniaturization.
2. Adapt to high fever
Since the thermal resistance of the microelectronic package will increase due to the reduction in size, the use environment of electronic equipment is complicated, so the heat dissipation of the package must be solved. Especially under high temperature conditions, the stability and reliability of long-term work must be guaranteed.
3. High density
As the integration of components is getting higher and higher, the number of pins required for microelectronic packaging is increasing, and the spacing between the pins is getting smaller and smaller.
4. Adapt to multiple pins
The increasing number of external leads is a major feature of microelectronic packaging, and of course it is also difficult, because the lead spacing cannot be infinitely small, it is difficult to supply solder stably during reflow, and the failure rate is very high.
And multi-pin packaging is the mainstream in the future, so the technical requirements of microelectronic packaging should be adapted to multi-pin as much as possible.
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