"The natural selection of the world, the survival of the fittest" is the law of all things in the world; in the business world, the market is the biggest driving force for technological innovation and product upgrading.
LED packaging, as a key link in the LED lighting industry chain, its technology research and development, new product introduction, large-scale listing plays a key role in the entire industry. With the market volume of commercial lighting and home lighting, LED spotlights and downlights with
COB as the light source have been widely used and have been basically recognized by consumers.
At present, the spotlights based on
LED lamp beads are hard to match the charm of LED COB spotlights. In fact, the industry has long believed that COB packaging is an inevitable trend in the future, because it has many advantages in heat dissipation, light distribution and cost. Compared with multiple low-power arrays, because of the parallel connection between light intensity and heat dissipation, it can effectively increase light intensity/heat. Resistance ratio. In addition, COB light sources are more convenient and easier to produce for downstream applications.
Compared with the patch-type light source, the COB light source has a more cost-effective advantage, which will bring convenience to downstream application manufacturers. It is convenient in processing, and two screws can be finalized. The future is moving towards the direction of automated mechanization, and COB light sources are easier to scale. Of course, the promotion process of COB light sources has not been smooth since its inception. “If a COB light source is used, if a lamp bead breaks during packaging, the entire COB will be scrapped, which increases the scrap rate of the finished product.†Liu Jianlin, R&D manager of Shenzhen Ruisi Technology Co., Ltd. said that COB technology Packaging companies have higher requirements for consistency.
The reason for restricting the popularity of COB light source is the market acceptance problem, not only because of the price, but also because the original packaging process has matured and the cost performance is relatively high. Now, customers who are suddenly replaced with COB light sources are not willing to accept it unless There are obvious advantages in technical performance, product quality, cost performance and market demand. With the gradual maturity of COB technology, packaging manufacturers no longer stay in the early stage of the ability to “mass productionâ€, and pursue the cost-effective stage of high-quality, high-efficiency COB. Domestic manufacturers have released new products, even international companies. High-efficiency COB products have been thrown out in an attempt to enhance brand influence through technological advantages.
On January 29, 2014, Samsung Electronics released the latest COB series products, claiming to once again improve the COB family's luminous efficiency to the highest level in the industry. At a color temperature of 3000K, the luminous efficiency reaches 130 lm/W, and at 5000 K, the luminous efficacy is 143 lm/W, and the CRI is also over 80. In addition, the new generation of LC series products have high light source consistency, concentrated in bin, meet the 3-step MacAdam ellipses of the three MacAdam ellipse, and have low thermal resistance and excellent heat dissipation, tested by LM80.
At the beginning of February, Guoxing Optoelectronics also launched a comprehensive metal substrate COB package series. It has the advantages of high luminous efficiency (100-120 lm/W) and high index (RA>80). In terms of thermal conductivity, the heat dissipation performance of the metal substrate series is significantly better than that of the ceramic COB light source; in product design, it can be flexibly customized according to customer needs. Change the serial mode of the original product chip; and the power is complete, covering 3W to 100W, can be applied to all kinds of lighting products.
In addition, Philips Lumileds, Seoul Semiconductor,
CREE , Luminus Devices (United States Lumen), Hongli Optoelectronics, Crystal Taiwan, Xuyu Optoelectronics, Shengpu Optoelectronics and other domestic and foreign excellent packaging companies also released COB new in the first quarter of this year Products, and even some companies have introduced flip chip technology in COB packaging, and many products have passed the LM-80 test, and the product quality is relatively guaranteed.
With the recognition of the market, in the future, COB light source will sprint to the packaging market with its advantages in cost and performance, which may threaten some domestic packaging enterprises that do not have technical advantages and cost advantages.
Guangzhou Ehang Electronic Co., Ltd. , https://www.ehangmobile.com