HiFi Audio DSP welcomes new partner Audyssey

Santa Clara, California, September 14, 2011 – Tensilica and Audyssey announced today that they are working together to apply Audyssey ’s award-winning audio technology to Tensilica ’s HiFi audio DSP (Digital Signal Processor) core, which will be used in Digital TV (DTV), automotive and mobile terminals and other fields.

"Audyssey provides unique, powerful expertise that corrects many audio problems. Other audio processing companies are committed to changing the effects of sound. However, Audyssey's approach is fundamentally different. They help content playback and be as close to the original sound as possible", Larry Przywara, senior director of multimedia marketing at Tensilica, said.

“Tensilica is the industry ’s leading and proven supplier of configurable processor IP. Given its high performance and low power consumption , porting our software to Tensilica ’s HiFi audio DSP is a wise decision for us Therefore, our technology will be spread to future products. Even chip manufacturers that used Tensilica's DSP before can also add our technology to the software, said Lenka Koloma, Audyssey authorized vice president.

Audyssey's audio technology solves the problems of sound and audio perception, and is committed to reproducing the content of audio, as close to the original sound as possible. This will help ensure that consumers get the best sound from home theaters, digital TVs, cars and mobile devices. Audyssey's technology provides a wealth of functional options, including expanded surround sound, maintaining presence at low volume, helping to eliminate distortion, maintaining optimal volume when people watch TV, and even preventing low-frequency sounds from disturbing neighbors.

Tensilica's HiFi audio DSP is currently the leading audio DSP core on the market and has been authorized by five of the world's top 10 semiconductor companies and many industry-leading original equipment manufacturers. The HiFi audio DSP solution includes more than 80 audio decoders, encoders, and audio enhancement software packages for efficient audio processing. Applications range from low-power mobile devices to high-performance home entertainment systems, such as set-top box Blu-ray disc players / recorders, and high-definition televisions.

Via In Pad PCB
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.

Via In Pad PCB

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